METHOD OF DETECTING DEFECT OF A PATTERN IN A SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070025609A1
SERIAL NO

11460574

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Abstract

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In a method of detecting a defect of the pattern in a semiconductor device, the pattern to be inspected is formed on a substrate, and then a thin film is continuously formed on the pattern, the defect of the pattern and the substrate to accurately detect the defect. The thin film has a reflectivity substantially greater than that of the pattern. The defect of the pattern is detected by inspecting the substrate having the thin film covering the pattern and the defect. A minute defect of the pattern such as residues or a micro bridge may be readily detected.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Hyung-Suk Gyeonggi-do, KR 16 100
KIM, Sung-Kweon Gyeonggi-do, KR 1 1
LIM, Kyu-Hong Gyeonggi-do, KR 6 32
RYU, Sung-Gon Gyeonggi-do, KR 2 2

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