Jig structure for manufacturin a stacked memory card

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United States of America Patent

APP PUB NO 20070029655A1
SERIAL NO

11195218

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Abstract

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A jig structure for manufacturing a stacked memory card, wherein the stacked memory card has a substrate forming with a package area and at least a electrical element, the jig structure is formed with a penetrated slot corresponding to the mounted area of the substrate and at least a protection cover corresponding to the electrical element.

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Patent Owner(s)

Patent OwnerAddress
KINGPAK TECHNOLOGY INCHSIN-CHU HSIEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Hong Tsu Hsinchu Hsien, TW 4 1
Lin, Jay Hsinchu Hsien, TW 6 4
Lung, Frank Hsinchu Hsien, TW 3 1
Lung, Men San Hsinchu Hsien, TW 3 1
Pai, Dennis Hsinchu Hsien, TW 8 4

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