Testing method detecting localized failure on a semiconductor wafer
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United States of America Patent
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Apr 7, 2009
Grant Date -
Feb 15, 2007
app pub date -
Mar 13, 2006
filing date -
Aug 10, 2005
priority date (Note) -
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Abstract
A method and system for testing a wafer comprising semiconductor chips are disclosed. A determination of whether or not the wafer is defective is made in relation to a spatially related group of filtered failed semiconductor chips on the wafer, where the spatially related group corresponds to a localized failure on the wafer and is used to calculate a defect index value.
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