Active cooling substrate support
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United States of America Patent
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Apr 29, 2014
Grant Date -
Feb 22, 2007
app pub date -
Aug 16, 2005
filing date -
Aug 16, 2005
priority date (Note) -
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Abstract
A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/−5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.
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