Systems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene
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United States of America Patent
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Issued Date -
Mar 1, 2007
app pub date -
Aug 23, 2005
filing date -
Aug 23, 2005
priority date (Note) -
Abandoned
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Abstract
Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. In one embodiment, the vapor compression refrigeration system includes a condenser, at least one expansion structure, at least one evaporator, and a compressor coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component. At least a portion of the at least one expansion structure is coated with a polytetrafluorethylene in the refrigerant flow path for inhibiting accumulation of material thereon. The polytetrafluorethylene coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area.
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