THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS
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United States of America Patent
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Issued Date -
Mar 1, 2007
app pub date -
Aug 25, 2006
filing date -
Aug 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.
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