Method for re-forming BGA of a semiconductor package
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United States of America Patent
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Issued Date -
Mar 1, 2007
app pub date -
Aug 26, 2005
filing date -
Aug 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for re-forming BGA of a semiconductor package includes the steps of, providing a semiconductor package element formed with balls grid array, at least one of diameter of the ball is larger than the others ; providing a jig formed with penetrated holes corresponding to the each of balls of the semiconductor package element ; providing the jig mounted to the semiconductor package element, each of balls is located within the corresponding to the penetrated holes, the at least one of bigger ball is exposed from the surface of the penetrated holes of the jig; grinding the exposed part of the balls to exact size; and re-working the processes of manufacturing BGA.
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