METHOD OF MANUFACTURING CONDUCTIVE LAYER
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United States of America Patent
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Issued Date -
Mar 1, 2007
app pub date -
Aug 30, 2005
filing date -
Aug 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a conductive layer is described. A substrate having a dielectric layer thereon is provided. The dielectric layer has a patterned structure and the patterned structure exposes a portion of the conductive layer. The surface of the substrate is cleaned in a first cleaning step and a cap layer is formed over the exposed portion of the conductive layer. Thereafter, the surface of the substrate is cleaned again in a second cleaning step to remove the residual cap layer on the surface of the dielectric layer. Finally, a dry cleaning step is performed to clean and dry the surface of the substrate.
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