Printed circuit board and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 13, 2009
Grant Date -
Mar 1, 2007
app pub date -
Aug 23, 2006
filing date -
Aug 24, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully