POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PADS
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United States of America Patent
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N/A
Issued Date -
Mar 1, 2007
app pub date -
Aug 26, 2005
filing date -
Aug 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and abrasive particles together; wherein the abrasive particles have an average diameter of between 1 nanometer and 100 nanometers in diameter, and wherein the abrasive particles comprise more than about 3% by weight of the polishing pad; mixing a curative with the mixed pre-polymer and particles; and pouring the mixture of pre-polymer, particles and curative into a mold. In one exemplary embodiment the particles are silica and the pre-polymer is a polyurethane pre-polymer.
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