System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process
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United States of America Patent
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app pub date -
Nov 6, 2006
filing date -
Dec 23, 2004
priority date (Note) -
Abandoned
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Abstract
Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.
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