High density interconnect assembly comprising stacked electronic module
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United States of America Patent
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Issued Date -
Mar 8, 2007
app pub date -
Aug 4, 2006
filing date -
Aug 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microelectronic module is provided with one or more first conductive pads on at least one of the exterior surfaces of the module for electrical interconnection of the functionality of the module to one or more second conductive pads on a second surface such as printed circuit board. A high density interposer assembly is disposed between the first conductive pads and second conductive pads. Outwardly projecting conductive elements on the interposer assembly are in registration with the first and second conductive pads whereby, when the interposer assembly is interposed between the first and second conductive pads, a mechanical connection is made between the elements, resulting in an electrical path between the first and second conductive pads.
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