EMI rejection for temperature sensing diodes

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United States of America Patent

PATENT NO 7622903
APP PUB NO 20070055473A1
SERIAL NO

11219151

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In one set of embodiments, a circuit may be implemented to deliver accurately ratioed currents to a remotely located semiconductor device that has a substantially non-linear input-output characteristic that varies with temperature and is subject to effects of electromagnetic interference (EMI). The circuit may be configured to use common mode rejection by establishing an identical impedance at each of the two terminals of the remotely located semiconductor device, in lieu of coupling shunting capacitor(s) across the terminals, in order to reject EMI signals while performing temperature measurements using the remotely located semiconductor device. This may facilitate maintaining fast sampling times when performing temperature measurements, while providing a more effective method for handling EMI induced currents that may lead to temperature measurement errors, thereby eliminating those errors.

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Patent Owner(s)

  • MICROCHIP TECHNOLOGY INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McLeod, Scott C Oro Valley , US 34 582

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