Package structure for an optical sensor
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United States of America Patent
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Issued Date -
Mar 15, 2007
app pub date -
Sep 14, 2005
filing date -
Sep 14, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical sensor and its peripheral frame are set upon the base in which the conductors can be located within the frame area or the area between the optical sensor and the frame; and a light-pervious lid encapsulates the frame and completes the package structure. In addition, an enclosing base having a containing capacity can be adopted to replace the base and the frame. The present invention can efficiently raise the reliability of elements and yield and quality by said package structure.
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