Methods and apparatus of stacking DRAMs
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United States of America Patent
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Dec 31, 2013
Grant Date -
Mar 15, 2007
app pub date -
Sep 1, 2006
filing date -
Sep 2, 2005
priority date (Note) -
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Abstract
Large capacity memory systems are constructed using stacked memory integrated circuits or chips. The stacked memory chips are constructed in such a way that eliminates problems such as signal integrity while still meeting current and future memory standards.
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