Group encapsulated dicing chuck
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United States of America Patent
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N/A
Issued Date -
Mar 22, 2007
app pub date -
Nov 27, 2006
filing date -
Jun 6, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
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