Method of coating a surface of a substrate with a metal by electroplating
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United States of America Patent
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Issued Date -
Mar 22, 2007
app pub date -
Nov 4, 2005
filing date -
Sep 20, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the said surface to be coated is brought into contact with an electroplating bath while the said surface is not under electrical bias; a step of forming the coating during which the said surface is biased; a step during which the said surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40 mM; and at least one copper complexing agent.
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