Image sensing device package structure
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United States of America Patent
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Issued Date -
Mar 22, 2007
app pub date -
Sep 21, 2005
filing date -
Sep 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensing device package structure is formed by using a base and a light transparent layer to package an image sensing device. The image sensing device is electrically connected to metallization traces on the base by means of wire bonding. Through change of the positions of the metallization traces, contacts between bonding wires and the metallization traces are made slightly higher than the top of the image sensing device, thereby shortening the wire bonding pitch of the bonding wires and thus reducing the package area.
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