Method for making a semiconductor device including a front side strained superlattice layer and a back side stress layer
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United States of America Patent
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Sep 25, 2006
filing date -
Jun 26, 2003
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Abstract
A method for making a semiconductor device may include forming a stress layer on a back surface of a semiconductor substrate and forming a strained superlattice layer adjacent a front surface of the semiconductor substrate. More particularly, the stress layer may include a material different than the semiconductor substrate. Also, the strained superlattice may include a plurality of stacked groups of layers. Each group of layers of the strained superlattice layer may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.
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