Image sensor package structure
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United States of America Patent
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Issued Date -
Mar 22, 2007
app pub date -
Sep 22, 2005
filing date -
Sep 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor package structure is proposed, in which the electric connection of an image sensing chip and the assembly of a housing and a lens barrel are separately carried out to avoid restriction in the packaging process and influence of outside contaminants. Moreover, corresponding faces of the housing and the lens barrel are designed to be smooth surfaces to reduce the probability of adhesion and accumulation of outside contaminants, thereby enhancing the process yield and also reducing the process cost.
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