Method of electrically connecting a microelectronic component
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United States of America Patent
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May 5, 2009
Grant Date -
Mar 22, 2007
app pub date -
Nov 20, 2006
filing date -
Dec 29, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.
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