Importance

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Abstract

A probe card for integrated circuit devices comprises a printed circuit board, at least one probe pin positioned on the printed circuit board, and at least one ultrasonic generator configured to generate ultrasonic energy. When the probe pin contacts a pad, the ultrasonic generator emits ultrasonic energy to vibrate the probe pin so as to form a recess on the surface of a dielectric layer such as an oxide layer on the pad, and the probe pin is then pressed downward to scratch the dielectric layer to form a signal channel. While some contaminants such as oxide fragments usually adhere to the probe pin when the probe card is used to perform an electrical test of the integrated circuit device, the present invention can use ultrasonic energy to vibrate the probe pin so as to remove contaminants from the probe pin.

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First Claim