LOW MELTING TEMPERATURE COMPLIANT SOLDERS
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United States of America Patent
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Issued Date -
Mar 29, 2007
app pub date -
Jun 7, 2006
filing date -
Sep 26, 2005
priority date (Note) -
Abandoned
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Abstract
Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.
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