Cooling systems incorporating heat transfer meshes
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United States of America Patent
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Apr 13, 2010
Grant Date -
Apr 5, 2007
app pub date -
Dec 1, 2006
filing date -
Dec 23, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
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