Printed circuit board with differential pair arrangement
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United States of America Patent
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Mar 16, 2010
Issued Date -
N/A
app pub date -
Jul 21, 2006
filing date -
Aug 12, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board (PCB) with a differential pair arrangement includes a mounting area for receiving a chip, a plurality of first pads located near one edge of the mounting area, a plurality of second pads located near an opposite edge of the mounting area, the first pads and the second pads are arranged for receiving pins of the chip. A pair of vias is used for connecting layers of the PCB. The second pads are located between the vias and the mounting area. A differential pair includes two signal traces, one of the signal traces is connected to one of the first pads and routed to one of the vias through the mounting area, the other of the signal traces is routed through the mounting area and connected to one of the second pads and then routed to the other one of the vias.
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