Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device
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United States of America Patent
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Issued Date -
Apr 5, 2007
app pub date -
Sep 29, 2006
filing date -
Sep 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention concerns a method for extracting chips (20) from a silicon wafer (10) and for transferring each chip on an electronic device including the following steps: Extracting the good chips from the silicon wafer (10) and transferring them on a roll-up adhesive film (28) so that the chips are spaced out by a certain distance, Transferring the chips (20) from the roll-up film (28) directly and continuously on contacts (46, 48 or 58, 60) of the electronic device.
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