Photosensitive polyimide compositions
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United States of America Patent
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app pub date -
May 1, 2006
filing date -
Oct 12, 2005
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Abandoned
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Abstract
A photosensitive resin composition comprising a pre-imidized aromatic polyimide, which when coated on a silicon wafer, has a light transmittance at a wavelength of 365 nm of at least 1% and imparts low residual stress after cure. The composition can be patterned through I-line exposure followed by development with organic or alkaline solutions, and can be cured at relatively mild temperature to yield low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.
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