Molded integrated circuit package with exposed active area
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United States of America Patent
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-
Jul 22, 2008
Grant Date -
Apr 19, 2007
app pub date -
Dec 14, 2006
filing date -
May 20, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.
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