Finger sensor including enhanced ESD protection and associated methods
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United States of America Patent
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Dec 27, 2011
Grant Date -
Apr 19, 2007
app pub date -
Oct 18, 2006
filing date -
Oct 18, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.
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