Heat treatment jig for semiconductor silicon substrate
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United States of America Patent
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Oct 28, 2008
Grant Date -
Apr 19, 2007
app pub date -
Aug 11, 2006
filing date -
Feb 2, 2004
priority date (Note) -
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Abstract
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocations that occur as a result of the stress caused by the weight of the wafer itself or the deflection of the heat treatment jig itself.
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