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Abstract

An image sensor package structure includes a substrate having an upper surface, which is formed with equal amount of the first electrodes arranged at the each side of the upper surface, each the first electrode of the adjacent side of the substrate is corresponding electrically connected each other, so that the signal from one side of the substrate may be transmitted the adjacent side, the each side of the lower surface of the substrate is formed with second electrodes, each side of the second electrodes is less than the each side of the first electrodes of the upper surface, then the second electrode is electrically connected to the first electrode, so that the signal from the first electrode may be directly transmitted to the second electrode and through adjacent one side of the first electrode transmitted to the second electrode. A frame layer is arranged at the upper surface of the substrate. A chip is mounted at the upper surface of the substrate a, at least one side of the chip is formed with bonding pads, which are equal or not many than the first electrodes of the one side of the substrate. Wires are electrically connected the pads of the chip to the first electrodes of the substrate. A transparent layer is covered on the frame layer to encapsulate the chip.

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First Claim