Importance

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Abstract

An image sensor structure with a connector includes a substrate having an upper surface, which is formed with a central region and first electrodes arranged at the periphery of central region, and a lower surface is formed with second electrodes corresponding to electrically connect the first electrodes. A frame layer is arranged at the upper surface of the substrate, so that a cavity is formed between with substrate and frame layer. A chip is mounted at the central region of the upper surface of the substrate and is located within the cavity. A plurality of bonding pads is formed at the periphery of the chip. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, so that the signal from the chip is transmitted to the second electrodes of the substrate through the first electrodes. The transparent layer is covered on the frame layer to encapsulate the chip. The connector is mounted at the lower surface of the substrate for electrically connecting to the electrical element.

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First Claim