Image sensor package structure
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United States of America Patent
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Issued Date -
Apr 26, 2007
app pub date -
Oct 18, 2005
filing date -
Oct 18, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor package structure is proposed, in which an image sensor is fixed on a substrate having metallization traces and an adhesion layer. Electric paths of the package structure are changed from the COG (chip on glass) process to the CIS (CMOS image sensor) process to improve electric characteristics. Moreover, spacers are formed at appropriate positions to prevent glue overflow from contaminating the sensing regions and solder balls. The proposed package structure can also shrink the package area to greatly enhance the yield and quality.
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