Sensor having semiconductor chip and circuit chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Apr 26, 2007
app pub date -
Sep 19, 2006
filing date -
Oct 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sensor includes: a semiconductor chip having a sensing portion; a circuit chip; and first and second films. The sensing portion is disposed on a first side of the semiconductor chip. The first side of the semiconductor chip is electrically connected to the circuit chip through a bump. The first side of the semiconductor chip faces the circuit chip. The first film is disposed on the first side of the semiconductor chip. The first film covers the sensing portion, and is made of resin, and the second film is made of resin, and disposed on a second side of the semiconductor chip.
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