PRE-MOLDED LEADFRAME AND METHOD THEREFOR
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United States of America Patent
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Issued Date -
Apr 26, 2007
app pub date -
Oct 21, 2005
filing date -
Oct 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of terminal leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of terminal leads. A die is connected to die pad and the plurality of terminal leads.
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