Vapor compression cooling system for cooling electronics
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United States of America Patent
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N/A
Issued Date -
May 3, 2007
app pub date -
Nov 1, 2005
filing date -
Nov 1, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A vapor compression cooling system and method (10) is provided for cooling one or more microprocessors (12,14) via one or more cold plates (22,24) mated with the microprocessor(s). Each cold plate (22,24) includes an evaporator (32,34), and the cooling system (10) is designed to operate such that the quality of the refrigerant exiting the evaporator(s) (32,34) is less than 100% so as to maximize the cooling ability of the cold plate(s) (22,24), i.e., to avoid dry-out of the evaporator(s) (32,34). A suction line heat exchanger (26) is provided to protect the compressor (16) of the system (10) by increasing the quality of the refrigerant from the evaporator to at least 100% so as to provide vapor phase refrigerant to the compressor (16).
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