Image sensor module structure and a method for manufacturing the same
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United States of America Patent
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Issued Date -
May 3, 2007
app pub date -
Nov 1, 2005
filing date -
Nov 1, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An image sensor module structure and method for manufacturing the same includes a substrate having an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, an adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the adhered layer is pressed to cover the wires, and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
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