Vapor compression circuit and method including a thermoelectric device
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United States of America Patent
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Jul 13, 2010
Grant Date -
May 10, 2007
app pub date -
Jan 30, 2006
filing date -
Nov 9, 2005
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Abstract
A system and method includes a thermoelectric device in heat-transfer relation with a working fluid flowing through a vapor compression circuit. Heat is transferred from the working fluid to a first fluid medium and then from the first fluid medium to a second fluid medium.
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