BRACE FOR WIRE LOOP
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United States of America Patent
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N/A
Issued Date -
May 10, 2007
app pub date -
Nov 8, 2006
filing date -
Nov 9, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of connecting a lead frame (12) lead finger (16a) to a bond pad (18a) on an integrated circuit (IC) die (10) includes bonding a first bonding wire (20a) from the lead finger (16a) to an intermediate point (22). A second bonding wire (20b) is bonded from the lead finger (16a) to the bond pad (18a) such that the first bonding wire (20a) supports the second bonding wire (20b).
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