Method and system for high volume transfer of dies to substrates
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United States of America Patent
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Issued Date -
May 17, 2007
app pub date -
Nov 4, 2005
filing date -
Nov 4, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.
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