Image sensor with a compound structure
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United States of America Patent
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Issued Date -
May 17, 2007
app pub date -
Nov 17, 2005
filing date -
Nov 17, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensor with a compound layer includes a substrate, a chip, wires, a compound layer, and a transparent layer. The substrate has an upper surface, which is formed with a central region and first electrodes arranged at the each side of the central region, and a lower surface, which is formed with second electrodes. The chip is mounted at the central region of the upper surface of the substrate. The chip has a sensor region and a plurality of bonding pads. The wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The compound layer is located on the side of the chip and is covered on the wires. The transparent layer is arranged on the compound layer to cover the chip, so that the sensor region of the chip may be received optical signal through the transparent layer.
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