Packaging structure of RSMMC memory card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
May 17, 2007
app pub date -
Nov 14, 2005
filing date -
Nov 14, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a packaging structure of a RSMMC memory card. The packaging structure comprises a substrate having a plurality of integrated circuit (IC) devices and passive devices located therein. A frame engaging with the substrate is surrounded with the IC devices and the passive devices. A metal cover having an insulating layer is engaged with the frame to form a thin layer of structure. A plurality of fixed plates bending downward are formed around a circumferential area of the metal cover, and a protruding plate and fixing slots are formed on one end of the pre-selected fixed plates bending outward. The frame and the metal cover are integrated together to form a sealed structure. The integrated circuit devices and the passive devices are located within the space of the frame to form a RSMMC memory card package.
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