Alloys for flip chip interconnects and bumps
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 24, 2007
app pub date -
Nov 22, 2006
filing date -
Nov 23, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides alloys for forming sputtered under bump metallization seed layers and electroplated or otherwise deposited bump metallurgy. The alloys of the present invention are comprised of silver with gold or palladium, copper with gold, or gold with nickel or palladium which provide suitable sputtering and electrical characteristics and resistance to corrosion and tarnishing. The invention further provides for semiconductor devices made from metal alloys for UBM and bump metallurgy, and for a method of making such semiconductor devices.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully