Method for the production of light-emitting semiconductor diodes
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United States of America Patent
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N/A
Issued Date -
May 24, 2007
app pub date -
Dec 3, 2004
filing date -
Dec 9, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method is disclosed for creating a light assembly including a light-emitting diode and a printed circuit board having conductors printed thereon. The method includes the steps of positioning the light-emitting diode on the printed circuit board. Once positioned, the light-emitting diode is connected to the printed circuit board. The light-emitted diode and the printed circuit board are positioned in a mold. A thermoplast is injected into the mold such that the thermoplast extends on both sides of the printed circuit board and over the light-emitting diode.
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