Wire under dam package and method for packaging image-sensor
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United States of America Patent
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N/A
Issued Date -
May 31, 2007
app pub date -
Nov 28, 2005
filing date -
Nov 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An wire under dam package and method for packaging image-sensor. The image-sensor package includes: a substrate having a first surface and a second surface, a sensing chip being laid on the first surface, the sensing chip having multiple soldering pads; multiple inner electric contacts arranged on the first surface, the soldering pads and the inner electric contacts being electrically connected via soldering wires; a frame bank attached to the first surface, rear ends of the soldering wires soldered with the inner electric contacts being sandwiched between the frame bank and the first surface; and a transparent board laid on the frame bank for sealing the sensing chip.
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