Processing liquid coating apparatus and a processing liquid coating method
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United States of America Patent
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Issued Date -
May 31, 2007
app pub date -
Oct 27, 2004
filing date -
Oct 31, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a processing liquid coating apparatus and a processing liquid coating method suitable for use in a lithography process for forming fine circuit patterns on a surface of a substrate such as a semiconductor wafer. The processing liquid coating apparatus according to the present invention includes a substrate holder (1) for holing and rotating a substrate (W), and a processing liquid supply unit (2) disposed apart from the substrate (w) held by the substrate holder (1). The processing liquid supply unit (2) has a plurality of supply ports (5, 6) for supplying a processing liquid to a plurality of portions including a central portion (C) of a surface of the substrate (W). A resist liquid or a developer is used as the processing liquid.
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