Memory Module System and Method
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United States of America Patent
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app pub date -
Jan 29, 2007
filing date -
May 18, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.
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