Integrated circuit with configurable bypass capacitance
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United States of America Patent
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Issued Date -
Jun 7, 2007
app pub date -
Dec 7, 2005
filing date -
Dec 7, 2005
priority date (Note) -
Abandoned
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Abstract
An integrated-circuit die includes a bypass capacitance shared between two or more circuit blocks. The bypass capacitance is selectively connected to whichever of the circuit blocks is active (e.g., to a transmitting block while a receiving block is off or in a standby mode). Some embodiments include bypass select logic that can be used to customize the bypass resistance and capacitance on a chip-wide or circuit-specific basis.
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