Transferring die(s) from an intermediate surface to a substrate
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United States of America Patent
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N/A
Issued Date -
Jun 14, 2007
app pub date -
Dec 13, 2005
filing date -
Dec 13, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Dies that are attached to a die plate can be transferred to a substrate. An actuator can be used to cause a die to be released from the die plate and to come into contact with the substrate. For example, the die may cover a corresponding hole in the die plate. The actuator can move a pin into the hole in the die plate, thereby pushing the die from the die plate. The actuator may be actuated by an electromagnetic stimulus. For instance, a solenoid having windings around a tubular core may provide the electromagnetic stimulus to the actuator. Current may be provided to the windings of the solenoid to generate the electromagnetic stimulus that actuates the actuator. The actuator may be provided in the tubular core of the solenoid.
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