Surface processing agent for tin or tin alloy material
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 14, 2007
app pub date -
May 17, 2004
filing date -
May 16, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn--Zn alloy based solder particle (1), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (2). There are also disclosed a solder material (6) in which a protective film (2) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn--Zn based solder particle (1), and a solder paste formed of this solder material (6) and the flux.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully